More about our company
Our technology combines the best of Silicon (Si) and Indium Phosphide (InP) materials using wafer-scale bonding for enabling lasers integration. It is compatible with the commercial silicon photonic foundries process to mass-produce fully integrated photonic chips.
To become a dependable, independent supplier of silicon photonics integrated circuits for the high-speed optical communication applications, serving primarily the need of Datacenters Operators. Longer-term, we want to expand in Lidar and Quantum photonics applications, leveraging the coherent modulation technology used in advanced optical communications.