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Scintil Photonics Speeds Up Communications in Data Centers

  • Aug 3, 2022
  • 1 min read


Silicon photonics integration enables cost-effective, low-power optical interconnects in high-performance computing (HPC) systems and data centers. Scintil Photonics, a spinoff from CEA-Leti, has raised €13.5 million to accelerate the manufacturing and commercialization of its III-V silicon photonic ICs for optical interconnects.



 
 
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Scintil Photonics is the global leader in DWDM laser sources for AI. Using its SHIP™ (Scintil Heterogeneous Integrated Photonics) technology, Scintil developed LEAF Light™, the world's first single-chip DWDM laser source for high-density and low power optical connectivity in scale-up networks. Headquartered in Grenoble, France, with operations across North America, Scintil is built to support global needs for advanced AI infrastructure

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