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SCINTIL Heterogeneous Integrated Photonics (SHIP™) technology

Silicon Photonics (SiPho) is constantly evolving, driven by data transmission requirements that demand improved speed (Gbps), power efficiency (pJ/bit), and efficient use of optical fibers (channels/fiber).

Traditional DFB lasers have been widely adopted to power optical transmissions in data centers due to their single-mode, mode-hop free operation and output power capability. Laser arrays have received considerable attention in recent years for their application in various DWDM systems.

However, realizing a DWDM DFB laser array remains very challenging because it requires precise control of the laser frequency spacing (e.g., ± 25 GHz on a 100 GHz grid). DFB laser frequencies are controlled by the grating period. SHIP™ leverages the capability of silicon photonics foundries, so the DFB gratings can be precisely and repeatedly patterned in silicon by deep-UV photolithography and manufactured in volume.

Technologie SCINTIL

Our unique BackSide-on-BOX approach enables the monolithic integration of silicon and InP/III-V materials. Unprocessed InP/III-V dies are bonded on the backside of processed wafers, only where it is needed. Our fabrication process is built on top of standard silicon-photonics process.
 

SHIP™ technology enable the fabrication of silicon photonic circuit with integrated DFB lasers, Si modulators, Ge-photodetectors, low loss SiN and Si waveguides.

BackSide-on-BOX III-V bonding

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ABOUT US

Scintil Photonics is a fabless company developing and commercializing silicon photonic integrated circuits with integrated lasers for AI datacenters. Based on the company’s disruptive SHIP™ process technology, Scintil enables optical interconnects to achieve low-latency, high-density, power-efficiency and ultra-high-speed. Scintil is an international company headquartered in France, with offices in Canada and the United States.

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