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TECHNOLOGY: III-V/InP bonding on Silicon

Our unique approach, called BackSide-on-BOX, enables seamless integration of lasers and optical amplifiers by combining Si and InP/III-V materials. Our technology solve the pain of standard silicon photonics lacking lasers.

Unprocessed InP/III-V dies are bonded on the backside of processed wafers, only where it is needed. Our fabrication process is CMOS-compatible and relies on the standard silicon-photonics process.

This technology enables to produce and monolithically integrate DFB lasers and SOAs, Si modulators, Ge-waveguide photodetectors, SiN and Si devices.

FABRICATION STEPS: III-V/InP Integration steps with Silicon Photonics

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