TECHNOLOGY
Our unique approach, called BackSide-on-BOX, enables seamless and extensive integration of active and passive optical components by combining Si and InP/III-V materials.
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Unprocessed InP/III-V dies are bonded on the back of processed Silicon-On-Insulators (SOI) wafers, only where it is needed. Our fabrication process is CMOS-compatible and relies on the standard silicon-photonics process. Our optical component library includes lasers (WDM laser arrays & tunable lasers), modulators, SOA, waveguides, wavelength filters, surface fiber couplers, and photodetectors.
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Fabrication Steps
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CONTACT US
SCINTIL Photonics
BHT – Bât. 52
7, parvis Louis Néel – CS 20050
38040 Grenoble cedex 09
France