Our unique approach, called BackSide-on-BOX, enables seamless and extensive integration of active and passive optical components by combining Si and InP/III-V materials.
Unprocessed InP/III-V dies are bonded on the backside of processed Silicon-On-Insulators (SOI) wafers, only where it is needed. Our fabrication process is CMOS-compatible and relies on the standard silicon-photonics process. Our optical component library includes lasers (WDM laser arrays & tunable lasers), modulators, SOA, waveguides, wavelength filters, surface fiber couplers, and photodetectors.
BHT – Bât. 52
7, parvis Louis Néel – CS 20050
38040 Grenoble cedex 09