SCINTIL Heterogeneous Integrated Photonics (SHIP™) technology
Silicon Photonics (SiPho) is constantly evolving, driven by data transmission requirements that demand improved speed (Gbps), power efficiency (pJ/bit), and efficient use of optical fibers (channels/fiber).
Traditional DFB lasers have been widely adopted to power optical transmissions in data centers due to their single-mode, mode-hop free operation and output power capability. Laser arrays have received considerable attention in recent years for their application in various DWDM systems.
However, realizing a DWDM DFB laser array remains very challenging because it requires precise control of the laser frequency spacing (e.g., ± 25 GHz on a 100 GHz grid). DFB laser frequencies are controlled by the grating period. SHIP™ leverages the capability of silicon photonics foundries, so the DFB gratings can be precisely and repeatedly patterned in silicon by deep-UV photolithography and manufactured in volume.
Our unique BackSide-on-BOX approach enables the monolithic integration of silicon and InP/III-V materials. Unprocessed InP/III-V dies are bonded on the backside of processed wafers, only where it is needed. Our fabrication process is built on top of standard silicon-photonics process.
SHIP™ technology enable the fabrication of silicon photonic circuit with integrated DFB lasers, Si modulators, Ge-photodetectors, low loss SiN and Si waveguides.