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TECHNOLOGY

Our unique approach, called BackSide-on-BOX, enables seamless and extensive integration of active and passive optical components, combining the best of Silicon (Si) and Indium Phosphide (InP) materials.

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Unprocessed InP dies are bonded on the back of the wafers, only where is needed. Our fabrication process is CMOS-compatible and relies on the commercial silicon-photonics process. Our optical component library includes lasers (WDM laser array, tunable laser), modulators, SOA, waveguides, wavelength filters, surface fiber couplers, and photodetectors. 

 
Fabrication Steps
 
Benefits

PERFORMANCE

AND 

RELIABILITY

  • ​High-coupling efficiency of lasers in the waveguide

  • No alignment of lasers needed

  • Optical amplification on-chip

  • High-speed modulator with low insertion loss

  • Intrinsic hermetic desin

FEATURE-RICH

IN A COMPACT FORM FACTOR

  • All-optical components in one-chip, including lasers

  • Germanium (Ge) for efficient photodetector

  • Silicon Nitride (SiNx) for improved passive devices 

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COST OPTIMISED 

FOR VOLUME

  • Production in commercial foundry â€‹

  • Wafer-level lasers integration & test 

  • Flip-chip assembly for Electronic IC

  • No hermetic package needed

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Publications

1.

Back-Side-on-BOX Heterogeneous Laser Integration for Fully Integrated Photonic Circuits on Silicon

©2020 by SCINTIL Photonics.