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TECHNOLOGY

Our unique approach, called BackSide-on-BOX, enables seamless and extensive integration of active and passive optical components, combining the best of Silicon (Si) and Indium Phosphide (InP) materials.

Unprocessed InP dies are bonded on the back of the wafers, only where is needed. Our fabrication process is CMOS-compatible and relies on the commercial silicon-photonics process. Our optical component library includes lasers (WDM laser array, tunable laser), modulators, SOA, waveguides, wavelength filters, surface fiber couplers, and photodetectors. 

 
Fabrication Steps
 
Benefits

PERFORMANCE

AND 

RELIABILITY

  • High-coupling efficiency of lasers in the waveguide

  • No alignment of lasers needed

  • Optical amplification on-chip

  • High-speed modulator with low insertion loss

  • Intrinsic hermetic desin

FEATURE-RICH

IN A COMPACT FORM FACTOR

  • All-optical components in one-chip, including lasers

  • Germanium (Ge) for efficient photodetector

  • Silicon Nitride (SiNx) for improved passive devices 

COST OPTIMISED 

FOR VOLUME

  • Production in commercial foundry 

  • Wafer-level lasers integration & test 

  • Flip-chip assembly for Electronic IC

  • No hermetic package needed

 
Publications

©2020 by SCINTIL Photonics.