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LASER-AUGMENTED SILICON PHOTONICS FOR DATACENTER, AI/ML & 5G NETWORKS

Our Photonic Integrated Circuits (PIC) rely on standard silicon photonics and monolithically integrates DFB lasers and/or optical amplifiers (SOA), for improved performance, energy-efficiency, and simplified packaging.

MATRx SCINTIL

PIC with integrated DFB lasers for Pluggable Optics

PIC with integrated DFB lasers for Pluggable Optics

Supports 800G and 1.6T data rate with coarse Wavelength Division Multiplexed (CWDM4).

LEAFLight SCINTIL

Integrated multi-wavelength laser source for Co-Packaged Optics ​

Integrated multi-wavelength laser source for Co-Packaged Optics

Delivers 8 or 16 wavelength spaced by 100 GHz or 200 GHz and multiplexed on 2 to 4 ports. Can be supplied as a fully packaged Circuit with its control electronics.

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We address the latest requirements of the pluggable optics deployed in datacenters network and HPC clusters for speed of 800Gbps and beyond. As Optical I/O penetrates deeper into the High-Performance Computing (HPC) clusters, External Laser Source modules provide the multi-wavelength light sources for photonic circuits co-packaged with the processing units for even denser, faster and lower-power optical interconnects.

Datacenters and AI

Datacenters

AI/ML 

Lasers Integration with
Silicon Photonics

Technology SCINTIL

Our technology enables a new level of photonic system integration with the heterogeneous integration of III-V materials with silicon.

Our BackSide-on-BOX integration process of III-V materials leverages standard Silicon Photonics processing, available from commercial foundries to produce at scale, Silicon Photonic ICs (PICs) with integrated lasers.

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