LASER-AUGMENTED SILICON PHOTONICS FOR DATACENTER, AI/ML & 5G NETWORKS
Our Photonic Integrated Circuits (PIC) rely on standard silicon photonics and monolithically integrates DFB lasers and/or optical amplifiers (SOA), for improved performance, energy-efficiency, and simplified packaging.
We address the latest requirements of the pluggable optics deployed in datacenters network and HPC clusters for speed of 800Gbps and beyond. As Optical I/O penetrates deeper into the High-Performance Computing (HPC) clusters, External Laser Source modules provide the multi-wavelength light sources for photonic circuits co-packaged with the processing units for even denser, faster and lower-power optical interconnects.
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Datacenters
AI/ML
Lasers Integration with
Silicon Photonics
Our technology enables a new level of photonic system integration with the heterogeneous integration of III-V materials with silicon.
Our BackSide-on-BOX integration process of III-V materials leverages standard Silicon Photonics processing, available from commercial foundries to produce at scale, Silicon Photonic ICs (PICs) with integrated lasers.