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AUGMENTED SILICON PHOTONICS FOR DATACENTER, AI/ML & 5G NETWORKS

Our Photonic Integrated Circuits (PIC) rely on standard silicon photonics and monolithically integrates DFB lasers and/or optical amplifiers (SOA), for improved performance, energy-efficiency, and simplified packaging.

MATRx SCINTIL

 Transceiver circuit’ family for Pluggable Optics 

MATRx Scintil Photonics

Transmit / Receive 8 x 100/200 Gbit/sec.

With integrated lasers (Wavelength Division Multiplexed or Parallel).

LEAFLight SCINTIL

External Laser Source circuit’ family for Co-Packaged Optics

LEAFLight Scintil Photonics

Delivers 8 or 16 lasers frequencies spaced by 100 GHz/200 GHz and multiplexed on 2 to 4 ports. Can be supplied as a fully packaged Circuit with its control electronics.

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We address the latest requirements of the pluggable optics deployed in datacenters network and HPC clusters for speed of 800Gbps and beyond.

As Optical I/O penetrates deeper into the High-Performance Computing (HPC) clusters, External Laser Source modules provide the multi-wavelength light sources for photonic circuits co-packaged with the processing units for even denser, faster and lower-power optical interconnects.

Datacenters and AI

Datacenters

AI/ML 

Lasers Integration with
Silicon Photonics

Technology SCINTIL

Our technology enables a new level of photonic system integration with the heterogeneous integration of III-V materials with silicon.

Our BackSide-on-BOX integration process of III-V materials leverages standard Silicon Photonics processing, available from commercial foundries to produce at scale, Silicon Photonic ICs (PICs) with integrated lasers.

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