More about our company
Our capacity to integrate laser sources efficiently on silicon will fuel a wave of innovations in Optical Communications, 3D Sensing, and Quantum photonics.
Our technology combines the best of Silicon (Si) and Indium Phosphide (InP) photonics on a single chip using wafer-scale bonding for integrating lasers. It is compatible with the commercial silicon photonic foundries process to mass-produce fully integrated photonic circuits.
To become a dependable, independent supplier of silicon photonics integrated circuits for the high-speed optical communication applications, serving primarily the needs of Datacenters. Longer-term, we also explore lidar applications and are keen to support quantum photonics development, leveraging the coherent modulation technology used in advanced optical communications.
BHT – Bât. 52
7, parvis Louis Néel – CS 20050
38040 Grenoble cedex 09