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Join us at the OIDA Workshop on Co-Packaging Technologies development for Data Centers on March 30th

There is a growing consensus that next generation (> 50Tbps) switching technologies will require embedded or co-packaged optical interconnects to achieve commercial bandwidth density requirements. System integrators are also looking to new architectures and devices to reduce power consumption. This will include highly integrated multi chip modules combining SiP and InP platforms and novel architectures to reduce energy consumption.


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