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Join us at the OIDA Workshop on Co-Packaging Technologies development for Data Centers on March 30th

  • SCINTIL
  • Feb 26, 2021
  • 1 min read

There is a growing consensus that next generation (> 50Tbps) switching technologies will require embedded or co-packaged optical interconnects to achieve commercial bandwidth density requirements. System integrators are also looking to new architectures and devices to reduce power consumption. This will include highly integrated multi chip modules combining SiP and InP platforms and novel architectures to reduce energy consumption.





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Scintil Photonics is a fabless company developing and commercializing silicon photonic integrated circuits with integrated lasers for AI datacenters. Based on the company’s disruptive SHIP™ process technology, Scintil enables optical interconnects to achieve low-latency, high-density, power-efficiency and ultra-high-speed. Scintil is an international company headquartered in France, with offices in Canada and the United States.

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